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RumahProdukPenyambung, InterconnectsSoket untuk IC, Transistor

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Bandingkan Gambar Bahagian # Pengeluar Penerangan Inventori Helaian data RoHS Cara Selesai Ketebalan - Post Suhu Operasi pemasangan Jenis penamatan Jenis ciri-ciri Bahan Terbakar Rating perumahan bahan Pitch - Mengawan Cara Selesai - Mengawan Cara Selesai Ketebalan - Mengawan Cara Selesai - Post Siri Bilangan Jawatan atau Pins (Grid) Hubungi bahan - Mengawan Pitch - Post Hubungi bahan - Post Penamatan Post Negara hubungan rintangan Penarafan Semasa (AMPS) Nombor produk asas Pakej Kuantiti
8444-21B1-RK-TR 8444-21B1-RK-TR 3M CONN SOCKET PLCC 44POS TIN Dalam stok11559 pcs 8444-21B1-RK-TR.pdf 160.0µin (4.06µm) -40°C ~ 105°C Surface Mount Solder PLCC Closed Frame UL94 V-0 Polybutylene Terephthalate (PBT), Glass Filled 0.050' (1.27mm) Tin 160.0µin (4.06µm) Tin 8400 44 (4 x 11) Copper Alloy 0.050' (1.27mm) Copper Alloy 0.132' (3.35mm) 15mOhm 1 A 8444 Tape & Reel (TR)
116-83-642-41-001101 116-83-642-41-001101 Preci-Dip CONN IC DIP SOCKET 42POS GOLD Dalam stok35378 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.6' (15.24mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 116 42 (2 x 21) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-83 Bulk
116-87-324-41-018101 116-87-324-41-018101 Preci-Dip CONN IC DIP SOCKET 24POS GOLD Dalam stok40957 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 116 24 (2 x 12) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-87 Bulk
116-83-306-41-003101 116-83-306-41-003101 Preci-Dip CONN IC DIP SOCKET 6POS GOLD Dalam stok45579 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 116 6 (2 x 3) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-83 Bulk
116-83-624-41-009101 116-83-624-41-009101 Preci-Dip CONN IC DIP SOCKET 24POS GOLD Dalam stok31209 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.6' (15.24mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 116 24 (2 x 12) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-83 Bulk
116-87-422-41-013101 116-87-422-41-013101 Preci-Dip CONN IC DIP SOCKET 22POS GOLD Dalam stok32160 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.4' (10.16mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 116 22 (2 x 11) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-87 Bulk
116-87-318-41-007101 116-87-318-41-007101 Preci-Dip CONN IC DIP SOCKET 18POS GOLD Dalam stok49303 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 116 18 (2 x 9) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-87 Bulk
D01-9953242 D01-9953242 Harwin Inc. CONN SOCKET SIP 32POS GOLD Dalam stok3306 pcs D01-9953242.pdf 196.9µin (5.00µm) -55°C ~ 125°C Through Hole Wire Wrap SIP - UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Tin D01-995 32 (1 x 32) Beryllium Copper 0.100' (2.54mm) Brass 0.510' (12.95mm) 10mOhm 1 A D01-995 Bulk
116-87-420-41-003101 116-87-420-41-003101 Preci-Dip CONN IC DIP SOCKET 20POS GOLD Dalam stok43568 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.4' (10.16mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 116 20 (2 x 10) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-87 Bulk
30-3513-11H Aries Electronics CONN IC DIP SOCKET 30POS GOLD Dalam stok40639 pcs 30-3513-11H.pdf 10.0µin (0.25µm) -55°C ~ 105°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Closed Frame UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Gold Lo-PRO®file, 513 30 (2 x 15) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) - 3 A 30-3513 Bulk
551-90-173-16-005003 Mill-Max Manufacturing Corp. CONN HDR SOLDRTL Kehabisan stok 551-90-173-16-005003.pdf 200.0µin (5.08µm) - Through Hole Solder PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 551 173 (16 x 16) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) - - 551-90 Bulk
614-41-308-41-001000 Mill-Max Manufacturing Corp. SKT CARRIER PGA Dalam stok36718 pcs 614-41-308-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 614 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm 3 A 614-41 Tube
08-2501-30 Aries Electronics CONN IC DIP SOCKET 8POS TIN Dalam stok39783 pcs 08-2501-30.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.2" (5.08mm) Row Spacing Closed Frame UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 501 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) - 1.5 A 08-2501 Bulk
515-13-101-13-061002 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok 515-13-101-13-061002.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 515 101 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm 3 A 515-13 Bulk
517-87-599-54-131111 Preci-Dip CONN SOCKET PGA 599POS GOLD Dalam stok46701 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 517 599 (54 x 54) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 517-87 Bulk
558-10-652M35-001104 Preci-Dip BGA SURFACE MOUNT 1.27MM Dalam stok40985 pcs   10.0µin (0.25µm) -55°C ~ 125°C Surface Mount Solder BGA Closed Frame UL94 V-0 FR4 Epoxy Glass 0.050' (1.27mm) Gold 10.0µin (0.25µm) Gold 558 652 (35 x 35) Brass 0.050' (1.27mm) Brass 0.086' (2.20mm) 10mOhm 1 A 558-10 Bulk
511-91-084-13-081003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 511 84 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-91 Bulk
511-91-100-10-000001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Closed Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 511 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-91 Bulk
510-93-153-15-061003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Dalam stok42426 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 510 153 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-93 Bulk
04-7445-10 Aries Electronics CONN SOCKET SIP 4POS TIN Dalam stok36558 pcs 04-7445-10.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Solder SIP Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Tin 200.0µin (5.08µm) Tin 700 Elevator Strip-Line™ 4 (1 x 4) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.150' (3.81mm) - 1.5 A 04-7445 Bulk
614-13-088-13-081001 Mill-Max Manufacturing Corp. SKT CARRIER PGA Kehabisan stok 614-13-088-13-081001.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 614 88 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm 3 A 614-13 Bulk
714-93-164-31-012000 Mill-Max Manufacturing Corp. SOCKET CARRIER SIP 64POS Dalam stok35963 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder SIP - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead - 64 (1 x 64) Beryllium Copper 0.100" (2.54mm) Brass Alloy - - - - -
400-PRS20001-12 Aries Electronics CONN SOCKET PGA ZIF GOLD Dalam stok37847 pcs 400-PRS20001-12.pdf 200.0µin (5.08µm) -65°C ~ 125°C Through Hole Solder PGA, ZIF (ZIP) Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS) 0.100' (2.54mm) Gold 30.0µin (0.76µm) Tin PRS - Beryllium Copper 0.100' (2.54mm) Beryllium Copper 0.125' (3.18mm) - 1 A 400-PRS Bulk
9-1437504-3 TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS TIN Kehabisan stok 9-1437504-3.pdf 200.0µin (5.08µm) -55°C ~ 125°C Chassis Mount Solder Transistor, TO-3 Closed Frame - Polytetrafluoroethylene (PTFE) - Tin 200.0µin (5.08µm) Tin 8080 3 (Oval) Beryllium Copper - Beryllium Copper - - - 1437504 Bulk
104-11-328-41-770000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Dalam stok32567 pcs 104-11-328-41-770000.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Press-Fit DIP, 0.3" (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 104 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) 10mOhm 3 A 104-11 Tube
20-6503-21 Aries Electronics CONN IC DIP SOCKET 20POS GOLD Dalam stok34361 pcs 20-6503-21.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.6" (15.24mm) Row Spacing Closed Frame UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 503 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) - 3 A 20-650 Bulk
522-13-223-18-095001 Mill-Max Manufacturing Corp. SKT PGA WRAPOST Kehabisan stok 522-13-223-18-095001.pdf 10.0µin (0.25µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 522 223 (18 x 18) - 0.100" (2.54mm) - 0.370" (9.40mm) - - 522-13 Bulk
05-0513-11 Aries Electronics CONN SOCKET SIP 5POS GOLD Dalam stok31596 pcs 05-0513-11.pdf 10.0µin (0.25µm) - Through Hole Solder SIP - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Gold 0513 5 (1 x 5) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) - 3 A 05-0513 Bulk
10-0513-11 Aries Electronics CONN SOCKET SIP 10POS GOLD Dalam stok48826 pcs 10-0513-11.pdf 10.0µin (0.25µm) - Through Hole Solder SIP - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 0513 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) - 3 A 10-0513 Bulk
510-87-176-16-001101 Preci-Dip CONN SOCKET PGA 176POS GOLD Dalam stok47822 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 510 176 (16 x 16) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 510-87 Bulk
511-91-299-20-096003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 511 299 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-91 Bulk
40-0501-20 Aries Electronics CONN SOCKET SIP 40POS TIN Dalam stok40453 pcs 40-0501-20.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Wire Wrap SIP - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Tin 200.0µin (5.08µm) Tin 501 40 (1 x 40) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.420' (10.67mm) - 1 A 40-0501 Bulk
511-93-096-11-041002 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 511 96 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-93 Bulk
510-13-142-15-085003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Dalam stok33799 pcs 510-13-142-15-085003.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 510 142 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-13 Bulk
510-83-221-18-091101 Preci-Dip CONN SOCKET PGA 221POS GOLD Dalam stok35942 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 510 221 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm 1 A 510-83 Bulk
03-0511-11 Aries Electronics CONN SOCKET SIP 3POS GOLD Dalam stok34529 pcs 03-0511-11.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder SIP - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Gold 511 3 (1 x 3) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.150' (3.81mm) - 1 A 03-0511 Bulk
33-7XXXX-10 Aries Electronics CONN SOCKET SIP 33POS TIN Kehabisan stok 33-7XXXX-10.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Solder SIP Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Tin 200.0µin (5.08µm) Tin 700 Elevator Strip-Line™ 33 (1 x 33) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.150' (3.81mm) - 1.5 A 33-7XXX Bulk
110-41-632-41-105000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Dalam stok48962 pcs 110-41-632-41-105000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Surface Mount Solder DIP, 0.6" (15.24mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 110 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 110-41 Tube
551-10-124-14-071003 Mill-Max Manufacturing Corp. CONN HDR SOLDRTL Kehabisan stok 551-10-124-14-071003.pdf 10.0µin (0.25µm) - Through Hole Solder PGA Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 551 124 (14 x 14) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) - - 551-10 Bulk
614-43-310-31-007000 Mill-Max Manufacturing Corp. SKT CARRIER PGA Dalam stok31501 pcs 614-43-310-31-007000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 614 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm 3 A 614-43 Tube
110-41-652-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Dalam stok39340 pcs 110-41-652-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 110 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 110-41 Tube
510-91-124-13-041001 Mill-Max Manufacturing Corp. SOCKET SOLDERTAIL 124-PGA Dalam stok46701 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) - - 124 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy - - - - -
20-4518-10H Aries Electronics CONN IC DIP SOCKET 20POS GOLD Dalam stok34211 pcs 20-4518-10H.pdf 200.0µin (5.08µm) - Through Hole Solder DIP, 0.4' (10.16mm) Row Spacing Open Frame UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Tin 518 20 (2 x 10) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) - 3 A 20-4518 Bulk
523-93-145-13-041001 Mill-Max Manufacturing Corp. SKT PGA WRAPOST Kehabisan stok   200.0µin (5.08µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 523 145 (13 x 13) - 0.100" (2.54mm) - 0.510" (12.95mm) - - 523-93 Bulk
515-93-299-20-096003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 515 299 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm 3 A 515-93 Bulk
511-93-400-20-000002 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Closed Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 511 400 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-93 Bulk
522-93-072-11-061001 Mill-Max Manufacturing Corp. SKT PGA WRAPOST Kehabisan stok   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 522 72 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm 3 A 522-93 Bulk
APA-632-T-C Samtec Inc. ADAPTER PLUG Dalam stok36456 pcs   - - Through Hole Solder - Open Frame UL94 V-0 Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - Tin APA 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - - - APA-632 Bulk
116-43-650-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Dalam stok47296 pcs 116-43-650-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 116 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.594" (15.09mm) 10mOhm 3 A 116-43 Tube
111-41-652-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL Dalam stok30104 pcs 111-41-652-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 111 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 111-41 Tube
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